Gold Epoxy Joining Material Au-Sn Eutectic Solders, Circuits PCB G298, 2.5gm

Description: Technical Product Bulletin Gold Epoxy, 2 Part, Electrically and Thermally Conductive, 2.5gm AA-BOND G298 PRODUCT DESCRIPTION: AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging. GENERAL PROPERTIES: Components A & B Appearance Resin: Brown, Hardener: Dark Brown Cure Type Room temperature or Heat cure Benefits · Gold filled epoxy allows for anti-oxidation of contacts and terminals in high reliability devices. · It can be used in medical circuits using traditional hybrid packaging technologies. · High viscosity paste allows for precision deposition onto circuits by means of printing and delicate hand processes. Mix Ratio by weight 100:13.5 / Resin: Hardener Substrates Metals, ceramics, glass, glass fabrics, wood leather and rigid plastics Operating Temperature -60 to 150 °C Typical Applications · Adhesive for joining die and SMDs onto the hybrid circuits. · Repairing defective Au thick-film conductor traces and contact pads. · Resisting oxidation and electro-migration in high-reliability micro-electronics. · Joining material as alternative to high temperature Au-Sn eutectic solders processes exceeding 300°C. UNCURED PROPERTIES: Viscosity (@ 0.5RPM/23°C): > 400,000 cPs Pot Life 30 min Thixotropic Index NA Degradation Temp.(TGA) 483°C Particle Size: ≤ 50 Microns MISC PROPERTIES: Volume Resistivity @ 23°C: ≤ 0.0009 Ohm-cm Glass Transition Temp, Tg ≥ 100°C (Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min) Die Shear Strength @ 23°C: ≥ 5 Kg / 1,700 psi Shelf life 1 year CURE SCHEDULE: 15 min @ 120°C 90 min @80°C 10 Hours @ 50°C 24 hours @ 25°C GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). HOW TO USE: 1. Carefully clean and dry all surfaces to be bonded 2. Apply this completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured 3. Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use 4. Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results AVAILABILITY: This epoxy can be supplied in many different packages. Froo www.froo.com | Froo Cross Sell, Free Cross Sell, Cross promote, eBay Marketing, eBay listing Apps, eBay Apps, eBay Application

Price: 252.99 USD

Location: Warwick, Rhode Island

End Time: 2024-12-24T16:55:01.000Z

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